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SOM Foundation and the Escuela Técnica Superior de Arquitectura de Madrid Announce the Third William F. Baker International Research and Design Forum

The SOM Foundation, in partnership with the Escuela Técnica Superior de Arquitectura de Madrid (ETSAM), is pleased to announce the third William F. Baker International Research and Design Forum. This year’s edition will take place on Thursday, November 6, 2025, and will be organized in partnership with the Escuela Técnica Superior de Arquitectura de Madrid (ETSAM) on the campus of the Universidad Politécnica de Madrid. The full-day event will include presentations by academics and industry leaders whose body of work, creativity, and expertise inspire the future of materiality, assembly, and technology in the built world.

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The Third William F. Baker International Research and Design Forum

November 6, 2025
Escuela Técnica Superior de Arquitectura
Universidad Politécnica de Madrid
Avenida Juan de Herrera 4
Madrid, 28040
Spain

“After successful editions of the forum organized in Chicago and Stuttgart, we are excited to be able to bring the forum to Madrid in November. With its long history of innovation in architecture and structural engineering, Madrid is the perfect place to bring together some of the most remarkable people practicing today. It will be a unique opportunity to learn from and discuss with students, faculty, and professionals how research and innovation can influence architecture and engineering,” said Iker Gil, Executive Director of the SOM Foundation.

“ETSAM at the Universidad Politécnica de Madrid is honored to host this distinguished event organized by the SOM Foundation, which provides an exceptional platform for reflection and exchange,” said Javier Francisco Raposo Grau, director of ETSAM. “We take particular pride in the fact that the themes under discussion are closely aligned with the principles of sustainability, inclusivity, and beauty that define the New European Bauhaus (NEB), to which our school is strongly committed. This convergence with the NEB vision, which we explored together with the Spanish Government's Ministry of Housing and Urban Agenda, further strengthens our collective commitment to advancing towards a more sustainable and inspiring future through architecture and design.”

The full-day event will include presentations by academics and industry leaders whose body of work, creativity, and expertise inspire the future of materiality, assembly, and technology in the built world. The forum is open to the public and welcomes design professionals, educators, and students. More information about the schedule and participating speakers will be available soon.

SOM Foundation Renames Event to William F. Baker International Research and Design Forum

The SOM Foundation is also pleased to announce the renaming of the event series from the International Research and Design Forum to the William F. Baker International Research and Design Forum, in honor of distinguished structural engineer William F. Baker, who is known for his commitment to structural innovation, particularly in the design of tall buildings. A consulting partner at SOM, Baker was instrumental in the establishment of the first forum in 2019 and remains deeply involved in the series.

The renaming of the forum also coincides with a multiyear donation by the Sarkisian Foundation for the Arts and Engineering that will support this and future editions of the series, securing its future. Among other initiatives, the Sarkisian Foundation for the Arts and Engineering supports research institutions that are committed to educating students through challenging, imaginative, and diverse curricula dedicated to the arts and engineering.

“On behalf of the Sarkisian Foundation, we are delighted to support the SOM Foundation and the William F. Baker International Research and Design Forum. The forum is one of the world’s most important reoccurring events focused on creating new architecture through research,” said Mark Sarkisian, Chair of the Sarkisian Foundation for the Arts and Engineering.

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